Method and device for producing electronic components
US7767591B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 21, 2006 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jul 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/441
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for producing electronic components in a vacuum. The aim of the invention is to create flexible electronic components that have an optimum action, are cost-effective, and easy to produce in a single working cycle. To this end, a carrier film (12) is partially and/or selectively compressed with a blocking liquid, and is subjected to cathodic sputtering. A metallic layer is deposited on the carrier film (12) in the region free of the blocking layer, and the blocking liquid is evaporated during the evaporation process. A semiconductor agent is applied to the coated carrier film (12) during another evaporation process, and a coating with acrylate is then carried out. The carrier liquid is then partially and/or selectively reapplied to the acrylate layer and a cathodic sputtering is carried out. The cited coating processes are optionally repeated, and connections can be established between the individual metallized layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.