Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device

US7767928B2 · kind B2 · utility

Assignee

• LASERTEC CORPORATION · JP

Inventors

• Michael Kuhl · Hafenhofen, DE
• Peter Wrba · Unterthingau, DE
• Peter Hildebrand · Pfronten, DE
• Martin Reisacher · Kempten, DE

Key dates

• Filing date: Sep 8, 2004
• Grant date: Aug 3, 2010
• Expiry date: Sep 8, 2024

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/361
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.