High dynamics laser processing machine
US7767932B2 · kind B2 · utility
6Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q11/0035
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Multi-axis laser cutting systems are provided. The cutting systems include a multi-axis, relatively high acceleration drive system, which includes drives that are configured to generate balanced inertial forces. In some implementations, the drives operate according to a polar coordinate systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.