Patent · US Active

High dynamics laser processing machine

US7767932B2 · kind B2 · utility

6Cited by
6References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 2007
Grant dateAug 3, 2010
Priority date
Expiry dateJul 30, 2028

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23Q11/0035
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Multi-axis laser cutting systems are provided. The cutting systems include a multi-axis, relatively high acceleration drive system, which includes drives that are configured to generate balanced inertial forces. In some implementations, the drives operate according to a polar coordinate systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.