Arrangements for an integrated sensor
US7768083B2 · kind B2 · utility
116Cited by
93References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2006 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Apr 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.