Semiconductor package
US7768122B2 · kind B2 · utility
4Cited by
5References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Apr 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a substrate having a first heat transfer path for transferring heat from an optical functional element to a back surface of the substrate, a first heat dissipation unit dissipating the transferred heat therefrom, a second heat transfer path for transferring heat generated in an internal cavity and heat from a window lid itself to a back surface and/or a side surface of the substrate, a second heat dissipation unit dissipating the transferred heat therefrom. The heat transfer paths extend through the substrate and have thermal vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.