Conformal mesh for thermal imaging
US7768376B2 · kind B2 · utility
3Cited by
8References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Oct 2, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K2213/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention provides thermal sensors and imagers that are flexible and capable of conforming to curved surfaces and corresponding methods of making and methods of thermal sensing. The thermal sensors contain an array of thermal resistors patterned in a row and column configuration, with each thermal resistor electrically isolated from other thermal resistors within the sensor. Thermal information is obtained from a region by measuring the resistance of each thermal resistor and calculating a thermal resistance for each entry of the array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.