Heating resistor element, manufacturing method for the same, thermal head, and printer
US7768541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Dec 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0095
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.