Method and apparatus for sealing flex circuits made with an LCP substrate
US7768619B2 · kind B2 · utility
0Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2004 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Dec 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.