Die module system
US7768796B2 · kind B2 · utility
6Cited by
271References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Jun 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.