Laser system and method for non-destructive bond detection and evaluation
US7770454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2004 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | May 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2672
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.