Patent · US Active

Modular system for the delivery of hot melt adhesive or other thermoplastic materials

US7770760B2 · kind B2 · utility

17Cited by
14References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 12, 2007
Grant dateAug 10, 2010
Priority date
Expiry dateApr 28, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/87885
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A modular system, for delivering hot melt adhesive or other thermoplastic materials, comprises a modular metering assembly, having a plurality of metering stations disposed therein, which is able to be attachably and detachably mounted upon a modular tank or supply assembly. Alternatively, one or more of the plurality of metering stations may be disposed externally of the modular metering assembly, and alternatively still further, one or more additional modular metering assemblies may be attachably and detachably connected to the first modular metering assembly. In this manner, the entire modular system exhibits enhanced versatility and flexibility in order to effectively implement different material application procedures that may be required for different end-user customers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.