Processing apparatus
US7771553B2 · kind B2 · utility
2Cited by
48References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2008 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | May 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a processing apparatus, such as a laminator, for performing operations involving effecting adhesive bonding on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.