Patent · US Expired

Sputtering cathode for coating processes

US7771574B2 · kind B2 · utility

0Cited by

9References

8Claims

0Family size

Assignee

Applied Materials GmbH & Co. KG · DE

Inventors

Jürgen Ulrich · Blankenloch, DE
Peter Sauer · Schlüchtern, DE

Key dates

Filing date	Jul 13, 2004
Grant date	Aug 10, 2010
Priority date	—
Expiry date	May 11, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3497
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A sputtering cathode (1) for coating processes in a vacuum chamber (18) comprises one at least single-piece target plate (2) mounted on a metallic diaphragm (3). On the side of the diaphragm (3) facing away from the target plate (2) is disposed a cooling agent channel with an inflow line (9) and an outflow line (10) for a cooling agent and a hollow space (7) for at least one magnet system (5). The magnet system (5) is disposed in a supporting tub (6) sealed against the diaphragm (3) and not exposed to the cooling agent. The entire configuration is disposed on a supporting structure (12). In order to improve the heat transfer from the target plate (2) to the cooling agent in simple, efficient and cost-effective manner and to avoid the hazard of the cooling agent penetrating into the vacuum chamber, the invention provides that

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.