Particle lithography method and ordered structures prepared thereby
US7771787B2 · kind B2 · utility
0Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2005 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | May 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Particles having a non-uniform property, such as non-uniform charge, can be used to form complex yet controlled particle assemblies. In one method of fabrication, particles are located on a substrate, and a surface treatment applied to the exposed portion of the particle surface. The surface treatment modifies the particle properties within the exposed portion. One or more lithographed regions are not exposed to the surface treatment, providing spatial selectivity in inter-particle bonding after the particles are removed from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.