Production process of structured material
US7771791B2 · kind B2 · utility
1Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Jun 10, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/855
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a process for producing a structured material, comprising the steps of forming a film on a substrate, forming a plurality of holes in a first region of the film, forming a plurality of holes composed of a hole wall member different from a hole wall member of the holes contained in the first region in a second region other than the first region, filling the holes in the first and second regions with the same material, and modifying the material in at least one region of the first and second regions by a heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.