Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
US7771838B1 · kind B1 · utility
88Cited by
66References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 29, 2005 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Sep 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12875
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A component assembly for use in living tissue comprises: a ceramic part; a metal part; and a titanium palladium (Ti—Pd) interface layer for bonding said ceramic part to the metal part. In one embodiment, the interface layer may be formed from a single titanium layer in contact with a single palladium layer, or in other embodiments, may be at least a three layer laminate (Pd—Ti—Pd). A microstimulator housing comprising a ceramic part, a titanium or titanium alloy part sandwiching the Ti—Pd interlayer may be employed to create a eutectic bond that is strong and hermetic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.