Moisture protection metal enclosure
US7772682B1 · kind B1 · utility
12Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2006 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Dec 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a substantially hermetically sealed enclosure about an active device area of a semiconductor substrate. The enclosure is created by forming a guard ring around the active device area on the substrate, and forming a metal panel over and in contact with the guard ring to enclose the active device area. The guard ring is a laminate of metal rings formed from alternating metal filled via rings and metal trace rings. The guard ring is formed on an ohmic contact ring on the surface of the substrate. An annealing process may be used to hermetically seal the guard ring to the ohmic contact ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.