Electronic circuit unit
US7772688B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Jun 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electronic circuit unit having at least one semiconductor (15), that is situated on a substrate, and whose electrical connections are in electrical contact with printed circuit traces of the substrate, and having a housing, that accommodates the substrate, which has contact paths which are connected to the printed circuit traces of the substrate using electrical connections. It is provided that the electrical connections (20) each have a contact surface (17) situated on the substrate (12) which, when the substrate (12) and the housing (2) are joined together, comes to lie in an opposing position to the counter-contact surfaces (19) of the contact paths (21). The present invention also relates to a corresponding manufacturing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.