Tape overlay for laser bond inspection
US7775122B1 · kind B1 · utility
7Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Mar 3, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.