Plate heat exchanger
US7775264B2 · kind B2 · utility
8Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Oct 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/364
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plate heat exchanger comprising plates (21, 31) interconnected by soldering and adapted to exchange heat between a high and a low temperature fluid may be designed to improve the cooling of the parts of the plates located near inlets (3) for the high temperature fluid by providing separate fluid channels (23, 26) in pairs of plates (21, 31) guiding low temperature fluid, said separate channels (23, 26) at least partly surrounding said inlets (3) for the high temperature fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.