Patent · US Active

Method of sealing a face of a MST device

US7776175B2 · kind B2 · utility

5Cited by
15References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 19, 2005
Grant dateAug 17, 2010
Priority date
Expiry dateFeb 8, 2027

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/1062
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

A method of sealing an attachment face of a MST device to a mounting surface on a support member, the attachment face having an aperture connected to a first fluid conduit, the attachment face having a second aperture connected to a second conduit, the method comprising the steps of: Using a thermosetting adhesive instead of a thermoplastic adhesive provides a far more reliable seal. The bond between the thermoplastic adhesive and the MST device surface is prone to thermal fatigue and leakage or outright failure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.