Method of sealing a face of a MST device
US7776175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Feb 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of sealing an attachment face of a MST device to a mounting surface on a support member, the attachment face having an aperture connected to a first fluid conduit, the attachment face having a second aperture connected to a second conduit, the method comprising the steps of: Using a thermosetting adhesive instead of a thermoplastic adhesive provides a far more reliable seal. The bond between the thermoplastic adhesive and the MST device surface is prone to thermal fatigue and leakage or outright failure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.