Method and apparatus for electropolishing metallic stents
US7776189B2 · kind B2 · utility
7Cited by
5References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2006 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | May 17, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each of the elongated members to rotate on its respective longitudinal axis when immersed in an electrolytic solution. A continuous cathode is located in close proximity to each of the elongated members when they are immersed in the electrolytic solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.