Process for manufacturing micro- and nano- devices
US7776227B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jul 19, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jun 1, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing or etching a micro- or nano-scale pattern on a work piece is disclosed, including the steps of: (a) placing the work piece in an electrochemical reactor in close proximity to a patterned tool; (b) connecting the work piece such that it is the anode if is to be etched or the cathode if it is to be deposited, and the patterned tool such that it is the counter electrode; (c) pumping electrolytic fluid necessary for the electrolytic operation of the cell formed between the two electrodes; and (d) applying a current across the electrodes to etch or deposit the work piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.