Method for locating a sub-surface feature using a scatterometer
US7776625B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2006 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Dec 11, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/4788
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a method for manufacturing a semiconductor device. The method for manufacturing the semiconductor device, without limitation, may include providing a substrate having a sub-surface feature and a surface feature, and determining a location of the sub-surface feature relative to the surface feature using a scatterometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.