System and method for polishing surface of tape-like metallic base material
US7776793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2007 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jul 5, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/13
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.