Copper(I) formate complexes

US7777059B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Lars Wittenbecher · Mannheim, DE
• Heinrich Lang · Ergersheim, DE
• Yingzhong Shen · Nanjing, CN

Key dates

• Filing date: Dec 15, 2004
• Grant date: Aug 17, 2010
• Expiry date: Dec 17, 2027

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/08
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Copper (I) formate complexes of general formula LnCu(HCOO).x COOH are decomposed in order to separate metallic copper, wherein x is a number from 0 to 10, n amounts to, 2, 3 or 4 and the n ligands L represent, independent of one another, one of the following ligands: a phosphane of formula R1R2R3P; a phosphite of formula (R1O)(R2O)(R3O)P; an isocyanide of formula R1—NC; an alkene of general formula R1R2C═CR3R4; or an alkyne of general formula R1C═CR2; wherein R1, R2, R3 and R4 represent, independent of one another, hydrogen, a linear or branched, optionally partly or fully fluorinated alkyl, aminoalkyl, alkyoxialkyl, hydroxialkyl, phosphinoalkyl or aryl radical having up to 20 carbon atoms, with the exception of triphenylphosphino-copper (I) formate and 1,1,1-tris(diphenylphosphinomethyl)ethane-copper (I) formate.