Method for manufacturing divided waveplate filter
US7777154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jan 31, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method to manufacture a divided waveplate filter by laser irradiation. A material layer is formed on the surface of a substrate material. A laser oscillator programmed to form a predetermined pattern scans light to form the divided waveplates. In some embodiments, the divided waveplate material layer may be selectively removed by laser ablation. In some embodiments, the material layer has a phase-difference characteristic and the divided waveplates may be formed by removing the phase-difference characteristic of the material layer using laser light without removing the material layer itself. The material layer may be covered by a laser absorbing layer such as titanium oxide. The divided waveplate may be protected by covering the entire surface with a protective layer 6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.