Electric component

US7777283B2 · kind B2 · utility

Assignee

• Micronas GmbH · DE

Inventors

• Mirko Lehmann · Glückstadt, DE
• Ingo Freund · Endingen am Kaiserstuhl, DE

Key dates

• Filing date: Nov 26, 2004
• Grant date: Aug 17, 2010
• Expiry date: Dec 9, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N27/4148
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An electric component comprising a sensor and/or actuator chip with a substrate on which a passivating layer and a sensor and/or actuator structure consisting of an active surface area is arranged. The chip is surrounded by an encapsulation having an opening which forms an access to the at least one active surface area. A layer stack is arranged on the substrate, said stack of layers comprising from the passivating layer to the substrate at least one first strip conductor layer, a first electric insulating layer, a second strip conductor layer and a second electric insulating layer. The first conductor strip layer is fully arranged outside the area of the chip covered by the opening. At least one conductor strip of the second conductor strip layer is connected to the sensor and/or actuator structure.