White LED headlight
US7777405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jan 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A vehicle headlight (12) that employs a plurality of LED units (38) that emit white light. Each LED unit (38) employs chip-on-board technology where LED semiconductor chips (64) are mounted directly to a submount substrate (56) using solder or stud bumps (60). An elongated lens (28) is molded over the LED unit (38) in contact with a base substrate (48). Light emitted from the semiconductor chip (64) is reflected and directed by the lens (28) to generate a beam of light (58). Some of the light emitted from the LED semiconductor chip (64) is redirected back to the submount substrate (56) to be reflected back into the lens (28) to increase the light intensity of the LED unit (38). Several of the elongated lens (28) and associated LED units (38) are optically glued to a single prism (24) that collects all of the light beams from all of the LED units (38).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.