Power core devices and methods of making thereof
US7778038B2 · kind B2 · utility
4Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2005 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Apr 2, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.