Method for forming a MEMS
US7779522B2 · kind B2 · utility
5Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Sep 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
Abstract
Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.