Multi-layered blister card package and method for making the same
US7780007B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 8, 2006 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Nov 13, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D83/0463
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A multi-layered blister package and assembling method include a blister sheet having a blisters for containing a product therein and an opposing cover surface adjacent to blister openings. The package also includes a front sheet having apertures configured to receive the blisters and a back sheet coupled to at least a portion of the front sheet. The back sheet includes an inner back panel foldably connected to an outer back panel. The inner and outer back panels each include removable tabs each covering an access slot. The tabs and access slots of the inner and outer back panels are in alignment when the inner back panel is folded adjacent to the outer back panel. The cover surface of the blister sheet is positioned adjacent to the inner back panel such that each blister opening is in alignment with the tabs and access slots of the inner and outer back panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.