Patent · US Active

Braided solder

US7780058B2 · kind B2 · utility

3Cited by
22References
6Claims
0Family size

Inventors

Key dates

Filing dateFeb 27, 2008
Grant dateAug 24, 2010
Priority date
Expiry dateFeb 27, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12222
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.