Method of forming a component on a substrate
US7780059B2 · kind B2 · utility
6Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Aug 21, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a structure by a material additive process, the method comprising the steps: providing a substrate having a surface, providing an interlayer on the surface which conforms to the surface of the substrate, forming a melt pool in the interlayer, the depth of the melt pool being less than the depth of the interlayer, selectively depositing a material within the melt pool, allowing the material to solidify, and applying heat and pressure to diffusion bond the material to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.