Card guide and heatsink assemblies for pluggable electro-optic modules
US7780361B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | May 15, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.