Lead-free conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive
US7780878B2 · kind B2 · utility
8Cited by
7References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Oct 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Described herein are a silicon semiconductor device and a conductive lead-free silver paste for use in the front side of a solar cell device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.