High thermal conductivity materials with grafted surface functional groups
US7781063B2 · kind B2 · utility
6Cited by
69References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 14, 2005 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Mar 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials 30 and a host resin matrix 32. The HTC materials 30 form a continuous organic-inorganic composite with the host resin matrix 32 via surface functional groups that are grafted to the HTC materials 30 and form covalent linkages with the host resin matrix 32. Phonons 34 tend to pass along the HTC materials 30 as they travel through the host resin matrix 32, and phonons 36 pass to the next HTC material if the distance between these materials is less than n.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.