Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith
US7781131B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/11
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-type photosensitive resin composition comprises (A) an alkali-soluble resin having at least a polybenzoxazole precursor structure, (B) a sensitizer, and (C) a cyclic compound having an alcoholic hydroxyl group. A protecting layer and an insulating layer include a cured layer which is a cured product of the positive-type photosensitive resin composition. A semiconductor device and a display device include the cured layer. According to the present invention, a highly reliable positive-type photosensitive resin composition can be obtained even when cured at a low temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.