Method for producing an integrated circuit including a semiconductor
US7781294B2 · kind B2 · utility
22Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Nov 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/53
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing an integrated circuit including a semiconductor is disclosed. In one embodiment, crystal defects are produced by irradiation in the material of the underlying semiconductor substrate which crystal defects form an inhomogeneous crystal defect density distribution in the vertical direction of the semiconductor component and lead to a corresponding inhomogeneous distribution of the carrier lifetime.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.