Curable composition
US7781525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2005 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Jan 19, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable composition, which comprises: (A) an organic polymer having a reactive silicon-containing group, (B) a carboxylic acid and/or a metal salt of a carboxylic acid, (C) an amine compound having no reactive silicon group, (D) a silane compound substituted with an amino group and (E) a silane compound substituted with an epoxy group, wherein the ratio of the molar number (d) of all amino groups of the silane compound substituted with an amino group (D) contained in the composition to the molar number (e) of all epoxy groups of a silane compound substituted with an amino group (E) contained in the composition (i.e., the ratio of (d)/(e))) is 1 or more, and further the total amount of the component (D) and the component (E) with respect to 100 g of the component (A) is 30 mmol or more. The above curable composition is a curable composition which comprises an organic polymer having a silicon-containing group and being crosslinkable through the formation of a siloxane bonding, and which uses a curing catalyst free of an organotin compound and exhibits good adhesiveness and also stable curability even after it is stored.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.