Cure accelerators
US7781542B2 · kind B2 · utility
1Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/686
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.