Heat dissipation system and method
US7781991B2 · kind B2 · utility
1Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Nov 25, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B21/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat dissipation system used in an electronic device includes a plurality of fans positioned in the electronic device, a sensing module, and a processing module. The sensing module is configured for detecting temperature, relative humidity, and air pressure of airflow flowing in the electronic device. The processing module is configured for adjusting a voltage applied to each of the plurality of fans according to the detected temperature, relative humidity, and air pressure of the airflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.