Chip resistor
US7782174B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2006 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Sep 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/142
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.