Heat dissipation device
US7782617B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 15, 2009 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Apr 15, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0266
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.