Attachment apparatus for electronic boards
US7782622B1 · kind B1 · utility
5Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2006 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.