Low stress package
US7783142B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 24, 2008 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Dec 24, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.