Modularized interconnect between root complexes and I/O modules
US7783818B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Apr 9, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/0026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described are electronics enclosures having an I/O (input/output) module, a CPU (central processing unit) module having a root complex, and a pluggable, field-replaceable interconnect module electrically connected to the root complex of the CPU module by a first set of differential signal pairs and to the I/O module by a second set of differential signal pairs. The field-replaceable interconnect module provides a serialized communication path between the first and second sets of differential signal pairs for carrying serialized differential signaling corresponding to communications exchanged between the root complex of the CPU module and the I/O module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.