Method of forming a panel constrained layer damper treatment
US7784165B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Nov 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49968
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a panel constrained layer damper treatment from a laminate, having a panel and a visco-elastic layer attached thereto, by forming a panel constrained layer damper from the laminate to a predetermined shape is provided. Additionally, the method of the present invention includes attaching the panel constrained layer damper to a substrate to form the panel constrained layer damper treatment. The method may also include subjecting the panel constrained layer damper to heat energy to bond the visco-elastic layer to the substrate. In addition, various methods of attaching the panel constrained layer damper to the substrate are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.