Temperature sensor
US7785004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2008 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jun 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensing device is mounted to a structure of a building and senses temperature within a building space of the building. The temperature sensing device includes a housing. The housing includes a front surface that faces the building space when the temperature sensing device is mounted to the structure. The housing further includes a protrusion that protrudes from the front surface into the building space. The temperature sensing device further includes a mounting device within the housing and a temperature sensor mounted to the mounting device, the mounting device holding the temperature sensor within the protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.