Optical component and transceiver packaging
US7785020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2007 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Aug 17, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3897
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods of packaging a high density optical module. In one example embodiment, a method of packaging the high density optical module includes various acts. First, a first detachable fiber assembly is connected to an optical component disposed in the module such that the connection between the fiber assembly and the optical component is disposed inside a housing of the optical module. Next, the fiber included in the fiber assembly is spooled around a spooling assembly. Then, the receptacle is secured in a receptacle holder such that the receptacle is able to connect with an external fiber connector. Next, the fiber assembly is detached from the optical component. Finally, the optical component is heated such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows such that the optical component can be removed from the high speed printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.